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all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 1 of 14 www.diodes.com suggested pad layout ? diodes incorporated suggested pad layout based on ipc-7351a x1-dfn1006-2 / x2-dfn1006-2 / minimelf / melf / sod323 / sod123 / sod523 / sma / smb / smc dimensions x1-dfn1006-2 / x2-dfn1006-2 minimelf melf sod123 sod323 sod523 sma smb smc z 1.1 4.7 6.3 4.9 3.75 2.3 6.5 6.8 9.4 g 0.3 2.1 3.3 2.5 1.05 1.1 1.5 1.8 4.4 x 0.7 1.7 2.7 0.7 0.65 0.8 1.7 2.3 3.3 y 0.4 1.3 1.5 1.2 1.35 0.6 2.5 2.5 2.5 c 0.7 3.5 4.8 3.7 2.40 1.7 4.0 4.3 6.8 x3-dfn0603-2 x1-dfn1006-3 / x2-dfn1006-3 dimensions value (in mm) c 0.355 x 0.230 y 0.300 z 0.610 dimensions value (in mm) z 1.1 g1 0.3 g2 0.2 x 0.7 x1 0.25 y 0.4 c 0.7 x1-dfn1212-3 dimensions value (in mm) c 0.80 x 0.42 x1 0.32 y 0.50 y1 0.50 y2 1.50 z x c g y z y (2x) x (2x) c y c g1 g2 x x 1 z y2 x x1 (2x) y y1 (2x) c
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 2 of 14 www.diodes.com suggested pad layout ? diodes incorporated x1-dfn1212-3 type b dimensions value (in mm) c 0.80 x 0.42 x1 0.32 x2 0.90 y 0.50 y1 0.50 y2 0.20 y3 1.50 x1-dfn1411-3 dimensions value (in mm) z 1.38 g1 0.15 g2 0.15 x 0.95 x1 0.75 x2 0.40 y 0.75 c 0.76 x1-dfn1612-6 / x2-dfn1310-6 dimensions x1-dfn1612-6 x2- dfn1310-6 g1 0.15 0.16 g2 0.175 0.17 g3 0.15 0.15 x1 0.60 0.52 x2 0.25 0.20 y1 0.65 0.52 y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06 y3 x x1(2x) y y1 (2x) c y2 x2 c y x1 z g1 x x2 g2 b g3 a g2 x2 y2 y1 g1 x1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 3 of 14 www.diodes.com suggested pad layout ? diodes incorporated u-dfn1616-6 u-dfn1616-8 dimensions value (in mm) z 1.3 g 0.175 x1 0.50 x2 0.525 y 0.30 c 0.50 dimensions value (in mm) g1 0.15 g2 0.20 x1 0.65 x2 0.25 y1 1.25 y2 0.50 c 0.40 a 0.10 u-dfn2018-6 dimensions value (in mm) c 0.50 g 0.20 x 0.25 x1 1.60 y 0.35 y1 1.20 u-dfn2020-3 dimensions value (in mm) dimensions value (in mm) c 1.00 y1 0.60 g 0.15 y2 0.45 x 1.40 y3 0.45 x1 0.35 y4 0.698 x2 0.45 y5 0.313 x3 0.322 r1 0.225 x4 0.60 r2 0.05 y 1.10 r3 0.20 x1 g x2 z c y g1 y2 y1 c x1 x2 g2 a y xc x1 g y1 x1 c x3 x y4 y1 x2 y y2 y3 r3 r2 r1 g x4 y5
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 4 of 14 www.diodes.com suggested pad layout ? diodes incorporated u-dfn2020-3 type b u-dfn2020-6 dimensions value (in mm) c 1.30 g 0.24 x 0.35 x1 1.52 y 1.09 y1 0.47 y2 0.50 dimensions value (in mm) z 1.67 g 0.15 x1 0.90 x2 0.45 y 0.37 c 0.65 u-dfn2020-6 type b u-dfn2020-6 type e dimensions value (in mm) z 1.67 g 0.20 g1 0.40 x1 1.0 x2 0.45 y 0.37 y1 0.70 c 0.65 dimensions value (in mm) c 0.650 x 0.400 x1 0.285 x2 1.050 y 0.500 y1 0.920 y2 1.600 y3 2.300 u-dfn2510-8 u-dfn2523-6 dimensions value (in mm) c 0.5 c1 1.0 g 0.2 x 0.2 x1 0.4 y 0.6 y1 1.4 dimensions value (in mm) c 0.650 x 0.400 x1 1.700 y 0.650 y1 0.450 y2 1.830 y3 2.700 x y1 y y2 x1 c g g g yc z y x2 x1 g g y c z y1 x2 x1 g1 y1 x1 c x g c1 y x1 y1 x y3 y2 y c x1 y3 x (6x) c x2 y1 y2 y (2x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 5 of 14 www.diodes.com suggested pad layout ? diodes incorporated w-dfn3020-8 type b dimensions value (in mm) c 0.650 g 0.285 g1 0.090 x 0.400 x1 1.120 y 0.730 y1 0.500 y2 0.365 u-dfn3030-4 u-dfn3030-8 dimensions value (in mm) c 1.300 g1 0.100 g2 0.150 g3 0.830 g4 0.115 g5 0.135 g6 0.170 g7 0.500 g8 0.500 r 0.150 x 0.500 x1 1.375 x2 1.225 x3 1.175 y 1.980 y1 1.015 y2 0.715 y3 0.650 dimensions value (in mm) z 2.59 g 0.11 x1 2.49 x2 0.65 y 0.39 c 0.65 u-dfn3030-8 type e dimensions value (in mm) c 0.65 c1 2.35 x 0.30 y 0.65 y1 1.60 y2 2.75 c x1 g1 x y1 y y2 g y x (4x) c y3 (2x) y2 y1 g1 g3 g4 r g7 g8 x3 g5 x1 x2 g2 g6 z g x1 x2 yc y (x8) x (x8) c c1 y1 y2
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 6 of 14 www.diodes.com suggested pad layout ? diodes incorporated u-dfn3030-10 u-dfn3030-12 dimensions value (in mm) z 2.60 g 0.15 x 1.80 x1 0.60 y 0.30 c 0.50 dimensions value (in mm) z 2.60 g 0.15 x 1.80 x1 0.60 y 0.28 c 0.45 dfn322 dimensions value (in mm) c 0.65 g 0.20 x 0.35 x1 1.52 y 0.55 y1 0.98 y2 0.47 y3 0.63 y4 2.20 w-dfn5020-6 w-dfn5060-4 dimensions value (in mm) c 0.50 g 0.35 x 0.35 x1 0.90 x2 1.80 y 0.70 y2 1.60 y3 3.20 dimensions value (in mm) c 4.00 x 0.75 y 0.95 y1 6.20 z 4.75 c y z x x1 g g c y z x x1 g g x1 y3 y1 y (2x) x (3x) cc y2 y4 g y3 x2 x1 y2 xc y g y1 y (4x) x (4x) c z
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 7 of 14 www.diodes.com suggested pad layout ? diodes incorporated df-s / minidip msop-8 dimensions df-s minidip z 10.26 6.91 x 1.2 0.60 y 1.52 0.76 c 5.2 2.67 dimensions value (in mm) x 0.45 y 1.4 c1 4.4 c2 0.65 msop-8l-ep msop-10 dimensions value (in mm) c1 4.2 c2 0.65 x 0.32 x1 1.95 y 0.8 y1 1.65 dimensions value (in mm) x 0.30 y 1.4 c1 4.4 c2 0.50 powerdi ? 5 powerdi ? 123 / powerdi ? 323 dimensions value (in mm) c 1.840 g 0.852 x 3.360 x1 1.390 y 4.860 y1 1.400 dimensions powerdi ? 123 powerdi ? 323 g 1.0 0.5 x1 2.2 2.0 x2 0.9 0.8 y1 1.4 0.8 y2 1.4 1.1 x c y z x y c1 c2 x1 y1 x y c1 c2 x y c1 c2 g x c y1 (2x) y x1 (2x) x1 gx2 y2 y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 8 of 14 www.diodes.com suggested pad layout ? diodes incorporated powerdi ? 123 type b dimensions value (in mm) g 2.000 x 1.050 x1 4.100 y 1.500 powerdi ? 3333-8 powerdi ? 5060-8 dimensions value (in mm) c 0.650 g 0.230 g1 0.420 y 3.700 y1 2.250 y2 1.850 y3 0.700 x 2.370 x2 0.420 dimensions value (in mm) c 1.270 g 0.660 g1 0.820 x 4.420 x1 4.100 x2 0.610 y 6.610 y1 3.810 y2 1.020 y3 1.270 sm-8 so-8 dimensions value (in mm) c 1.52 c1 4.6 x 0.95 y 2.80 y1 6.80 dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 x y y1 y3 y2 x2 c 14 85 g g1 x x1 y y1 y2 g1 y3 (4x) x2 (8x) g c y1 y (8x) x (8x) c c1 x c1 c2 y x y x1 g
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 9 of 14 www.diodes.com suggested pad layout ? diodes incorporated sod323f dimensions value (in mm) x 0.710 x1 2.700 y 0.403 sop-14 dimensions value (in mm) x 0.60 y 1.50 c1 5.4 c2 1.27 sop-16 dimensions value (in mm) x 0.60 y 1.50 c1 5.4 c2 1.27 x1 y (2x) x (2x) x c1 c2 y x c1 c2 y
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 10 of 14 www.diodes.com suggested pad layout ? diodes incorporated sot143 sot223 dimensions value (in mm) z 2.70 g 1.30 x 2.50 x1 1.0 x2 0.60 y 0.70 c 2.0 dimensions value (in mm) x1 3.3 x2 1.2 y1 1.6 y2 1.6 c1 6.4 c2 2.3 sot523 / sot323 / sot23 / sc59 dimensions sot523 sot323 sot23 sc59 z 1.8 2.8 2.9 3.4 x 0.4 0.7 0.8 0.8 y 0.51 0.9 0.9 1.0 c 1.3 1.9 2.0 2.4 e 0.7 1.0 1.35 1.35 sot23f dimensions value (in mm) c 0.95 x 0.60 y 0.80 y1 1.80 x1 x2 g z y c x x2 x2 c1 c2 x1 y2 y1 x e y c z c y1 y (3x) x (3x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 11 of 14 www.diodes.com suggested pad layout ? diodes incorporated sc74r / sot26 / sot363 / sot563 sot25 / SOT353 / sot553 dimensions sc74r / sot26 sot363 sot563 z 3.20 2.5 2.2 g 1.60 1.3 1.2 x 0.55 0.42 0.375 y 0.80 0.6 0.5 c1 2.40 1.9 1.7 c2 0.95 0.65 0.5 dimensions sot25 SOT353 sot553 z 3.20 2.5 2.2 g 1.60 1.3 1.2 x 0.55 0.42 0.375 y 0.80 0.6 0.5 c1 2.40 1.9 1.7 c2 0.95 0.65 0.5 sot666 dimensions value (in mm) c 0.50 g 0.80 x 0.35 y 0.50 sot953 dimensions value (in mm) c 0.350 x 0.200 y 0.200 y1 1.100 x z y c1 c2 c2 g x z y c1 c2 c2 g x (6x) y (6x) c g y1 y (5x) c c x (5x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 12 of 14 www.diodes.com suggested pad layout ? diodes incorporated sot963 dimensions value (in mm) c 0.350 x 0.200 y 0.200 y1 1.100 sot89-3 sot89-5 dimensions value (in mm) x 0.900 x1 1.733 x2 0.416 y 1.300 y1 4.600 y2 1.475 y3 0.950 y4 1.125 c 1.500 dimensions value (in mm) x1 1.7 x2 0.55 x3 0.4 y1 4.6 y2 1.2 y3 0.5 y4 1.1 c 3.0 to252 (dpak) / to263 (d 2 pak) dimensions to252 / dpak to263 / d 2 pak z 11.6 16.9 x1 1.5 1.1 x2 7.0 10.8 y1 2.5 3.5 y2 7.0 11.4 c 6.9 9.5 e1 2.3 2.5 to252-4 dimensions value (in mm) c 1.27 c1 2.54 x 1.00 x1 5.73 y 2.00 y1 6.17 y2 1.64 y3 2.66 y1 y (6x) c c x (6x) y1 x1 y2 y c x (3x) y3 y4 x2 (2x) y1 x3 x1 y3 y2 x2 c y4 x2 c z x1 y1 e1 y2 x1 y1 y2 y3 y x (4x) c c1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 13 of 14 www.diodes.com suggested pad layout ? diodes incorporated to252-5 to263-5 dimensions value (in mm) x 5.6 x1 0.6 y 11.0 y1 5.6 y2 2.0 c1 7.2 c2 1.27 dimensions value (in mm) x 10.9 x1 1.05 y 15.7 y1 9.1 y2 2.5 c 1.7 tsot25 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 tsot26 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 y2 y y1 x c 2 c1 x1 y2 y y1 x c x1 y1 c c x (5x) y (5x) y1 c c x (6x) y (6x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 43 14 of 14 www.diodes.com suggested pad layout ? diodes incorporated tssop-14 dimensions value (in mm) x 0.45 y 1.45 c1 5.9 c2 0.65 u-wlb1010-4 dimensions value (in mm) c 0.50 d 0.25 u-wlb1510-6 dimensions value (in mm) c 0.50 c1 1.00 d 0.25 x c1 c2 y c c ?d c c1 c d

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